via molecular level mixing and spark plasma sintering (SPS). Gr/Cu composites were prepared by Yang et al. The EC is also 3.5% IACS (International Annealed Copper Standard) lower than pure Cu. However, its plasticity is reduced, and the elongation (EL) is only 18%. The YS of the prepared 2O 3/Cu composites can reach 300 MPa, which is 49% higher than that of pure Cu. reported a composite reinforcement phase with a pea-pod structure prepared via in-situ synthesis, which significantly improved the interface structure of the composites. However, the plasticity is 12.0% lower than that of pure Cu. The yield strength (YS) and tensile strength (TS) of its 1.0 vol % GN/Cu composites are 128.6 MPa and 288.6 MPa, respectively, which are 81.6% and 36.8% higher than those of pure Cu, respectively. Through the construction of GN, effective grain refinement strengthening, dislocation strengthening, and load transfer strengthening are achieved. The reinforcing and toughening effects of GN in GN/Cu composites are emphasized. constructed a Gr network (GN) in a Cu matrix via powder metallurgy. This limits the application of Gr, especially for Gr-reinforced CuMCs, where the use of Gr often results in an enhanced strength at the cost of a reduced plasticity or EC. However, despite the success of Gr as a reinforcing phase in polymers and ceramics, its application to metals is hampered by severe agglomeration and poor interfacial bonding with metal matrices. Graphene (Gr), a two-dimensional carbon nanomaterial discovered in 2004, has received much attention owing to its excellent electrical, thermal, and mechanical properties and is an ideal reinforcing material for metal matrix composites. The introduction of strengthening phases to prepare Cu matrix composites (CuMCs) is an effective method to achieve this goal. Therefore, preparing Cu with high EC, high strength, and high plasticity is an urgent requirement for scientific development. The reduced graphene oxide-reinforced Cu-matrix composites were studied, and it was found that the comprehensive performance of the /Cu composites is superior to that of the rGO/Cu composites in all aspects.Ĭu is widely used because of its excellent electrical conductivity (EC), but its application range is limited due to its poor mechanical properties. This path compensates for the negative influence of grain refinement and the sintering defects on EC. The optimized EC is due to constructing bridges between the large-size Cu grains, and graphene on the surface provides a fast path for electron motion. The plastic mechanisms include the coordinated deformation of the interface of the Cu 4O 3 and Cu 2O nanotransition layers and the increase in the fracture energy caused by graphene during the deformation process. The strength mechanisms include transfer load strengthening, dislocation strengthening, and grain refinement strengthening. Furthermore, EC is 95% IACS (International Annealed Copper Standard), which is also higher than that of Cu. The relative density (RD) of the /Cu composites exceeds 95%, and the hardness, UT, and yield strength (YS) reach 106.8 HV, 14,455 MPa% (tensile strength (TS) 245 MPa, elongation (EL) 59%), and 119 MPa which are 21%, 72%, and 98% higher than those of Cu, respectively. The results show that has a significant strengthening effect on the Cu matrix composites. In addition, as a flow carrier, SSCu can also render graphene uniformly dispersed. results in the formation of Cu 4O 3 and Cu 2O nanotransition layers to optimize the interface combination. In this study, Cu matrix composites reinforced with reduced graphene oxide-coated submicron spherical Cu ( ) exhibiting both high-strength plastic product (UT) and high electrical conductivity (EC) were prepared.
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